Semiconductor International 2000 - Abstracts

Semiconductor International 2000
TitleSubjectAuthors
300 mm lithography enters reality.Electronics and electrical industriesPhillip Ware
A better way of reducing monitor costs.Electronics and electrical industriesPeters Laura
Absolute pressure control boosts oxide uniformity.Electronics and electrical industriesDan Hall, Cole Porter, Lise Laurin
Addressing back-end lithography issues.Electronics and electrical industriesRuth DeJulle
A fab is not built by layout alone: the case for a concurrent utility matrix.Electronics and electrical industriesJohn Pinho, Sean Williamson
A fresh start for the new millennium.Electronics and electrical industriesPeter H. Singer
Amkor buys Anam factories.Electronics and electrical industries 
Automation needs reach new levels.Electronics and electrical industriesKarl Gartland, Ed Sherwood
A word about innovation.Electronics and electrical industriesDan Weber
Capability for 300 mm: approaching industry goals.Electronics and electrical industriesKarl E. Mautz
Characterize low-k and copper films in situ.Electronics and electrical industriesSteve Huang, S.H. Lau, Ann Koo
Chemical mechanical polishing optimized for premetal dielectrics.Electronics and electrical industries 
Detecting non-visual defects is vital for 0.18 micron.Electronics and electrical industriesTim Turner
Diagnosing latch-up with backside emission microscopy.Electronics and electrical industriesThomas Adams, Thomas Kessler, Friedrich-Wilhelm Wulfert
Enhancing CMP performance.Electronics and electrical industriesJoe Gisler
Etch tool readiness.Electronics and electrical industriesNick Bright
Europeans to develop ferroelectric CMOS process.Electronics and electrical industries 
Evaluating wafer inspection and cleaning with standard particles.Electronics and electrical industriesBenjamin Y.H. Liu, Seong-Ho Yoo, Seung-Ki Chae, James J. Sun, Kurt Christenson
Exhibitor outlook.Electronics and electrical industries 
Full-fab automation challenges.Electronics and electrical industriesMike Chase
How to reduce plasma damage in sputtering processes.Electronics and electrical industriesDuncan Perry, Peter Ansmann, Andreas Jaeger
Improving copper interconnects: a search for useful dopants.Electronics and electrical industriesJames A. Cunningham
Improving yield with protective ceramics.Electronics and electrical industriesG. Zhang
Interconnect deposition.Electronics and electrical industriesPaul Carey, Satheesh Kuppurao
Ion implantation challenges.Electronics and electrical industriesJim Kawski
IR method characterizes interstitial oxygen in silicon ingots.Electronics and electrical industriesWilliam M. Hughes, Haresh Siriwardane
Lessons learned from certifying a SMIF fab.Electronics and electrical industriesMichael Gatov, Bruce Whitefield
Life beyond mix-and-match: controlling sub-0.18 micron overlay errors.Electronics and electrical industriesTerrence E. Zavecz, Rene Blanquies, Amit Zeidler
Manage W-CVD process: effluents to boost uptime.Electronics and electrical industriesYoufan Gu, Kevin Grout, Steve Haupt
Marching toward SOC.Electronics and electrical industriesGenda Hu
Metrology challenges.Electronics and electrical industriesGeorge J. Collins
Microscopic imaging ellipsometry gives resolution, throughput.Electronics and electrical industries 
MIT demonstrates 25 nn Gates with chromeless phase-shift masks.Electronics and electrical industriesRuth DuJule
Mood swings at Semicon West.Electronics and electrical industries 
New gas combo improves dielectric etch.Electronics and electrical industries 
New life for conventional silicon technology?Electronics and electrical industries 
New strategy at NEC.Electronics and electrical industries 
PFCs in the semiconductor industry: a primer.Electronics and electrical industriesJoe Van Gompel
Philips advances 180 nm CMOS.Electronics and electrical industries 
Plasma abatement reduces PFC emission.Electronics and electrical industriesVictor Vartanian, Laurie Beu, Tom Lii, David Graves, Eric J. Tonnis, Rusty Jewett
Process module control for advanced gate dielectrics.Electronics and electrical industriesClive Hayzelden, Patrick Stevens, David McCain, Daniel Iversen
Qualifying flip-chip underfills.Electronics and electrical industriesKarl-Friedrich Becker, Tom Adams
Samsung Corning ups nanopowder business.Electronics and electrical industries 
Serching amidst illusion.Electronics and electrical industriesCarl Johnson
SISA to focus on supplier value chain.Electronics and electrical industriesPeter H. Singer
Smart card assembly: requires advanced pre-assembly methods.Electronics and electrical industriesJochen Muller, Peter Stampka, Werner Kroninger, Ernst Gaulhofer, Heinz Oyrer
Spin processing offers yield enhancement for 300 mm.Electronics and electrical industries 
Surface conditioning.Electronics and electrical industriesDale A. Courtney
Tailoring polymer properties with ion beams.Electronics and electrical industriesNathan Capps, Dan Carter, Greg Roche
Taking a new approach to copper ECD bath management.Electronics and electrical industriesOlivier Blachier, Jim Clark
Tantalum 101: economics and technology of Ta materials.Electronics and electrical industriesChristopher A. Michaluk, Richard O. Burt, David P. Lewis
The case for continuous flow transport of wafer carriers.Electronics and electrical industriesDavid Feindel, Ulrich Kaempf
Thermal processing: shrinking devices on larger wafers.Electronics and electrical industriesJoe Hasselbach, Nirmalya Maity, Stuardo Robles
Thermoplastic adhesives: alternative to thermosets.Electronics and electrical industriesRoy V. Buck Jr.
Using SEMs for automatic defect monitoring.Electronics and electrical industriesBenoit Hinschberger, Christine Gombar, Ariel Ben-Porath, Laurent Karsenti
WSC Internet policy.Electronics and electrical industries 
WSC joint statement.Electronics and electrical industries 
This website is not affiliated with document authors or copyright owners. This page is provided for informational purposes only. Unintentional errors are possible.