Semiconductor International 1998 - Abstracts
| Semiconductor International 1998 | |||||
| Title | Subject | Authors | |||
|---|---|---|---|---|---|
| 150 nm copper process for SRAMs. | Electronics and electrical industries | ||||
| 300 mm wafers: implications to fab architecture. | Electronics and electrical industries | Kerry Kiser | |||
| a-C:F carbon: a robust low-k material. | Electronics and electrical industries | ||||
| An update: transition to 300 CMP. | Electronics and electrical industries | Timothy Marbeiter | |||
| Asia-Pacific chip sales improved in April. | Electronics and electrical industries | ||||
| Backside emission microscopy pinpoints wafer level defects. | Electronics and electrical industries | Daniel T. Hurley, Denis Place | |||
| Bonding of CMOS processed wafers to glass substrates. | Electronics and electrical industries | ||||
| Bookham commences production. | Electronics and electrical industries | ||||
| British develop photoluminescent liquid crystal display. | Electronics and electrical industries | ||||
| Cadence to acquire Bell Labs EDA group. | Electronics and electrical industries | ||||
| Ceravision adopts FED technology from RAL. | Electronics and electrical industries | ||||
| Challenges for 300 mm polished wafer manufacturers. | Electronics and electrical industries | Graham R. Fisher | |||
| Chartered expects 20% growth in 1998. | Electronics and electrical industries | ||||
| CMP to cost $10 per wafer pass by 2003. | Electronics and electrical industries | ||||
| Cold plasma extends trace metal detection capability. | Electronics and electrical industries | Rob Mortensen, Tom Gluodenis | |||
| Consortium to tackle Cu etch, deposition and CMP needs. | Electronics and electrical industries | ||||
| Controlling static charge in spin rinser dryers. | Electronics and electrical industries | Arnold Steinman | |||
| Control of metal outplating from HF solutions. | Electronics and electrical industries | ||||
| Defect-free silicon crystal. | Electronics and electrical industries | ||||
| Design and validation of 0.25 micrometer integrated circuit yield model. | Electronics and electrical industries | Daren L. Dance, Fred Lakhani, Randy Williams | |||
| Die-sized displays enable new applicatins. | Electronics and electrical industries | Haviland Wright | |||
| Dual-damascene aluminum process developed. | Electronics and electrical industries | ||||
| Europe moves towards the 0.18 m era. | Electronics and electrical industries | ||||
| EUV LLC enters development agreement with newly formed U.S. Advanced Lithography. | Electronics and electrical industries | ||||
| Fab layout design methodology: case of the 300 mm fab. | Electronics and electrical industries | Doron Meyersdorf, Abolfazl Taghizadeh | |||
| Fujitsu and Hitachi to develop PDP technology. | Electronics and electrical industries | ||||
| Gas management confronts materials, cost and service issues. | Electronics and electrical industries | Alexander Braun | |||
| Glass serves as wafer level packaging. | Electronics and electrical industries | ||||
| High-selectivity silicon nitride etch process. | Electronics and electrical industries | Ying Wang, Leroy Luo, Rene George, Nicole Kuhl | |||
| HP to purchase Samsung's share in JV. | Electronics and electrical industries | ||||
| IBM to expand custom chip business. | Electronics and electrical industries | ||||
| Japan's market outlook for 1999 snd beyond. | Electronics and electrical industries | Hideki Motai | |||
| JMAR awarded $13 million DARPA contract. | Electronics and electrical industries | ||||
| Key industry trends at SEMICON West. | Electronics and electrical industries | ||||
| KGD testing in automotive applications. | Electronics and electrical industries | Haim Taraseiskey, Remy Degen, Rod Darling | |||
| Korea's raw material market to increase. | Electronics and electrical industries | ||||
| Laser post-CMP cleans. | Electronics and electrical industries | ||||
| LSI to build new fab in Japan. | Electronics and electrical industries | ||||
| Lucent Technologies licenses flash memory technology to Winbond. | Electronics and electrical industries | ||||
| Market outlook: feast or famine through 2000. | Electronics and electrical industries | ||||
| Micron buying TI's memory business. | Electronics and electrical industries | ||||
| MOSEL VITALEC, Powerchip launch PC100 compliant 64Mb SDRAM. | Electronics and electrical industries | ||||
| Motorola develops 0.10 m Cu process. | Electronics and electrical industries | ||||
| Motorola introduces AltiVec microprocessor technology. | Electronics and electrical industries | ||||
| Motorola to open Polish fab. | Electronics and electrical industries | ||||
| NEC develops embedded FeRAM for smart card chips. | Electronics and electrical industries | ||||
| NEC to build 300 mm fab in California. | Electronics and electrical industries | ||||
| New hydrogen purification technology developed. | Electronics and electrical industries | ||||
| New technology for removing post etch residues. | Electronics and electrical industries | ||||
| Photronics joins IMEC's optical lithography program. | Electronics and electrical industries | ||||
| Polymer process produces deep holes with high-aspect ratio. | Electronics and electrical industries | ||||
| Progress in managing PFCs. | Electronics and electrical industries | ||||
| Protection for satellite electronics. | Electronics and electrical industries | ||||
| Resists for next-generation masks. | Electronics and electrical industries | ||||
| RF Micro Devices opens GaAs Fab. | Electronics and electrical industries | ||||
| Samsung forms Alpha Processor subsidiary. | Electronics and electrical industries | ||||
| Semiconductor slump expected to rebound in 1999. | Electronics and electrical industries | ||||
| SGS-Thompson will construct 300 mm pilot line plant. | Electronics and electrical industries | ||||
| Somerset goes to Motorola. | Electronics and electrical industries | ||||
| The challenges of 300 mm wafer cleaning. | Electronics and electrical industries | Kurt K. Christenson, Jeffery W. Butterbaugh | |||
| The challenges of the copper CMP clean. | Electronics and electrical industries | ||||
| The environment, health and safety side of copper metalization. | Electronics and electrical industries | ||||
| Thin gate oxides promise high reliability. | Electronics and electrical industries | Chenming Hu, Donggun Park, Ya-Chin King | |||
| TI-Acer jv to become Acer subsidiary. | Electronics and electrical industries | ||||
| Toshiba develops environmentally friendly transistor package. | Electronics and electrical industries | ||||
| Toshiba develops reflective low-temperature polysilicon LCD technology. | Electronics and electrical industries | ||||
| USDC broadens technology directions. | Electronics and electrical industries | ||||
| UV microscopy resolves smaller features. | Electronics and electrical industries | Werner Hunn | |||
| Wafer level burn-in. | Electronics and electrical industries | ||||
| Wastewater treatment technology. | Electronics and electrical industries | ||||
| Yield enhancement through photosabilization. | Electronics and electrical industries | ||||
| Zilog Wafer Module III: a new age wafermanufacturing facility. | Electronics and electrical industries | E.A. Sack | |||
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